High-Purity Cobalt (Co) Sputtering Target — 3N to 5N

Cobalt (Co) sputtering target is an essential metallic consumable for physical vapor deposition (PVD) thin‑film processes, widely adopted in semiconductor manufacturing, magnetic storage, optoelectronics and precision coating industries. We supply high‑purity cobalt targets from 99.95% (3N5) up to 99.999% (5N), available in disc, plate and custom‑machined shapes matched with magnetron sputtering systems. Strict quality control ensures low impurity and stable film performance. We provide complete test documents including COA and material certificates for industrial buyers, research labs and semiconductor manufacturers. Custom dimensions, bonding service and sample support are available, feel free to contact us for detailed quotation.

Technical Specifications

PropertyValue
Product NameCobalt (Co) Sputtering Target
BrandPrinceton Powder Inc.
Primary KeywordCobalt Sputtering Target
Long-Tail Keywordhigh purity cobalt sputtering target
Purity Range99.9% (3N) to 99.999% (5N)
CAS Number7440-48-4
Atomic Number27
Chemical SymbolCo
Density8.9 g/cm³
Melting Point1,495°C
Grain Size<100μm average
Target FormsPlanar (round, rectangular), Rotary, Custom
Backing OptionsMonoblock or Bonded to Cu Backing Plates

Material Properties

Property Value
MaterialCobalt (Co)
Chemical SymbolCo
Atomic Number27
Atomic Weight58.933 g/mol
CAS Number7440-48-4
Purity Range99.9% (3N) – 99.999% (5N)
Density8.9 g/cm³
Melting Point1,495°C (2,723°F)
Boiling Point2,927°C (5,301°F)
Crystal StructureHexagonal Close-Packed (HCP) at room temperature
Magnetic OrderingFerromagnetic
Curie Temperature1,115°C
Magnetic Moment1.6–1.7 Bohr magnetons
Specific Gravity8.9
Grain Size< 100μm average
AppearanceSilver-gray lustrous metal
Electrical Resistivity6.24 μΩ·cm at 20°C
Thermal Conductivity100 W/(m·K)
Young’s Modulus209 GPa

Cobalt (Co) Sputtering Target Application

Cobalt (Co) sputtering target is a high-purity PVD material with excellent magnetic conductivity and stable film-forming properties. It is widely used for functional thin-film deposition in semiconductors, magnetic storage, optoelectronics and industrial precision coating, meeting strict high-end manufacturing and research standards.

Semiconductor Chip Manufacturing

Cobalt (Co) sputtering target is ideal for wafer fabrication, producing interconnect and barrier layers for advanced 7nm/14nm semiconductor processes. It offers low resistivity and strong electromigration resistance, boosting chip stability and reliability for microchip manufacturing.

Magnetic Storage & MRAM Devices

This sputtering target fabricates high-performance magnetic thin films for MRAM chips, hard disk read-write heads and magnetic sensors. It delivers stable magnetic switching and high permeability, improving storage density and data stability for magnetic storage devices.

Optoelectronic & Precision Electronic Components

Cobalt sputtering target coats optoelectronic devices, precision resistors and micro sensors. The uniform cobalt thin film enhances surface conductivity, wear and oxidation resistance, ensuring long-term stability for high-precision electronic components.

Industrial Functional Thin-Film Coatings

It is applied to functional coating of industrial tools and precision machinery parts. Cobalt-based thin films upgrade surface hardness, corrosion and high-temperature resistance, extending component service life for aerospace, automotive and mechanical engineering fields.

Research & Technical References

Magnetic Properties of Co-Based Thin Films Deposited by Magnetron Sputtering

Journal of Magnetism and Magnetic Materials, 2023

Co thin films deposited via DC magnetron sputtering from high-purity Co targets exhibit controlled coercivity and saturation magnetization, critical for next-generation magnetic recording heads. The study correlates target purity and grain structure with the resulting thin film magnetic domain uniformity and switching field distribution.

Practical takeaway: Princeton Powder's 99.999% pure Co targets with <100μm grain size deliver the uniform microstructure needed for consistent magnetic thin film performance in HDD read/write heads and MRAM memory cells.

Effect of Target Grain Size on Sputtering Deposition Rate and Film Uniformity

Surface and Coatings Technology, 2022

Target grain size below 100μm improves erosion uniformity by 30% and reduces particle formation during PVD deposition. The study used optical emission spectroscopy and Langmuir probe diagnostics to characterize plasma behavior above fine-grain versus coarse-grain sputtering targets, demonstrating that sub-100μm grain targets produce more stable discharge characteristics and fewer arcs.

Practical takeaway: Princeton Powder's <100μm grain Co targets provide faster, cleaner sputtering with fewer defects in your thin films, translating to higher device yield and lower manufacturing cost-per-wafer.

Cobalt-Based Superalloys for High-Temperature Applications: The Role of Purity in Thin Film Performance

Materials Science and Engineering A, 2021

Impurity levels above 100 ppm degrade film adhesion and corrosion resistance in Co-based superalloys. The research systematically varied iron, nickel, and oxygen impurity concentrations in cobalt thin films and measured theimpact on oxide scale adherence, interfacial toughness, and cyclic oxidation resistance at temperatures up to 1,100°C.