Aluminum Nitride AlN Powder (nano particles and microns)

Aluminum Nitride (AlN) Powder is a high-performance ceramic material known for its exceptional thermal conductivity, electrical insulation, and mechanical strength. Ideal for thermal management applications, AlN powder is widely used in electronics, semiconductors, and high-temperature environments.

Princeton Powder is a leading supplier of Aluminum Nitride ceramic powder. Aluminum powders including AlSi10Mg Spherical Powder, Aluminum 7075 Spherical Powder, and Aluminum 6061 Spherical Powder are for sale in bulk.

Aluminum Nitride AlN Powder

Formula

AlN

Synonyms

Aluminum Nitride, CAS 24304-00-5

Appearance

White gray Powder

Particle Size

-325 Mesh, or customized

Purity

99.9%, 3N

Density

 3.25 g/cm 3

Melting Point

2400 °C

Boiling Point

2249 ℃

Description of Spherical Aluminum Nitride Powder

Aluminum Nitride (AlN) Powder is a high-performance ceramic powder known for its exceptional thermal conductivity (up to 200 W/m·K), electrical insulation, and low thermal expansion coefficient. These unique properties make AlN ideal for thermal management applications, particularly in electronics, semiconductors, LEDs, and power devices.

Princeton Powder offers high-purity AlN powder (≥99.9%) in various particle sizes, including submicron and micron grades, suitable for sintering, ceramic substrates, thermal interface materials, and composite fillers. Aluminum Nitride (AlN) powder is for sale at a competitive price.

AlN ceramic substrate powder Specifications

Products

Purity (%)

Particle D50 (μm)

O (wt%)

Fe (ppm)

Si (ppm)

C (ppm)

AlN-1

99.9

1.39

0.75

30

10

255

AlN-2

99.9

1.07~1.17

0.78~0.6

10~14

39~48

130~270

 

Density

Thermal conductivity Coefficient

Thermal expansivity

Maximum usage temperature

Bending resistance

Specific volume resistance

Dielectric strength

>3.1 g/cm3

>120w/(m·k)

4.4×10-6 K

1800℃

>300Mpa

1014Ω·cm

15kV/mm

Aluminum Nitride Powder Applications

  • Electronic Substrates: High-performance insulators for microelectronic packaging

  • Heat Sinks and Spreaders: Thermal management components for LEDs and power ICs

  • Thermal Interface Materials (TIMs): Fillers in polymer-based thermal pastes and pads

  • Sintered Ceramics: Dense AlN ceramics for structural and insulation applications

  • Composite Materials: Reinforcement in polymer or metal matrix composites

Aluminum Nitride AlN powder Reference

Synthesis of Cubic Aluminum Nitride Coating from Al2O3 Powder in Reactive Plasma Spray Process

  • This study investigated the feasibility of reactive plasma spraying of Al2O3 powder in N2/H2 plasma upon fabrication of AlN coating. It was possible to fabricate a cubic-AlN (c-AlN)/Al2O3 composite coating and the fabricated coating consists of c-AlN, α-Al2O3, Al5O6N and γ-Al2O3. Furthermore, the AlN content was improved with increasing the flight time (spray distance), due to increasing the reaction time between the Al2O3 particles and the surrounding N2/H2 plasma.

Aluminum Nitride AlN powder FAQ

Is AlN electrically conductive?

No. Aluminum Nitride is electrically insulating, with very high resistivity. This makes it suitable for use in electronics where thermal dissipation is needed without electrical conduction.

What particle sizes are available?

AlN powder is available in:

  • Nano AlN powder (<100 nm)

  • Submicron AlN powder (0.5–1 μm)

  • Micron AlN powder (1–5 μm)
    Custom particle sizes and distributions are also available upon request.

What is the difference between AlN and BN or Si₃N₄?

  • AlN: Highest thermal conductivity; electrically insulating

  • BN (Boron Nitride) Powder: Soft, machinable, moderate thermal conductivity

  • Si₃N₄ (Silicon Nitride): Stronger and tougher, good thermal shock resistance